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Bill Kiang
Bill Kiang
TSMC
Electronic engineering
Chip
Chip-scale package
Materials science
Flip chip
4
Papers
8
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A new mechanism of signal path charging damage across separated power domain deep N-Well interface
2018
IRPS | International Reliability Physics Symposium
Yu-Lin Chu
Hsi-Yu Kuo
Sheng-Fu Hsu
Y. S. Tsai
Ming-Yi Wang
Chuan-Li Chang
Bill Kiang
Kenneth Wu
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Citations (1)
A CDM-like damage mechanism for multiple power domains fabricated with Deep N-well processes
2017
IRPS | International Reliability Physics Symposium
Yu-Lin Chu
Hsi-Yu Kuo
Jinn-Wen Young
Y. S. Tsai
Chin-Yuan Ko
Ming-Yi Wang
Chuan-Li Chang
Bill Kiang
Kenneth Wu
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Flip chip power cycling system development and lead free bump power cycling reliability
2012
ECTC | Electronic Components and Technology Conference
Max K. C. Wu
H. Y. Pan
Larry Lin
Christine Chiu
Tulip Chou
Gary Lu
Patrick Liu
Gene Wu
Han-Ping Pu
H.Y. Tsai
Bill Kiang
Kenneth Wu
M. J. Lii
C. H. Yu
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Low-K Flip Chip Board Level Reliability on 65nm Technology
2007
ECTC | Electronic Components and Technology Conference
Pei-Haw Tsao
Bill Kiang
Kenneth Wu
Abel Chang
Tsorng-Dih Yuan
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Citations (2)
1