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Andreas Knorr
Andreas Knorr
SEMATECH
Materials science
Composite material
Ceramic materials
Low-k dielectric
Porosity
3
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3
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Comparison of barrier-first and argon pre-clean first processes for copper metallization in ultra low-k (ULK) dual damascene integration
2006
Valli Arunachalam
Gregory C. Smith
Sridhar Kailasam
Andreas Knorr
Kam Hettiaratchi
Robert T. Rozbicki
Klaus Pfeifer
Paul S. Ho
Jung Woo Pyun
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The Effect of Methylating Treatments on the Dielectric Reliability of Low-k/Cu Structures
2005
Swarnal Borthakur
Sri Satyanarayana
Andreas Knorr
Paul S. Ho
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Pore Structure and Integration Performance of a Porous CVD Ultra Low k Dielectric
2005
Youfan Liu
Andreas Knorr
Wen-Li Wu
David Gidley
Bernd Kastenmeier
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Citations (3)
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