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Klaus Pfeifer
Klaus Pfeifer
SEMATECH
Copper
Porosity
Dielectric
Materials science
Tantalum
7
Papers
23
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Identification of a Novel BTS and RVB Failure Mechanism in Copper/Ultra-Low k Integrations using a Stopless Trench Etch
2006
IRPS | International Reliability Physics Symposium
Larry Smith
Ward Engbrecht
Yuri Solomentsev
Kyle Neuman
Ricky McGowan
Klaus Pfeifer
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Comparison of barrier-first and argon pre-clean first processes for copper metallization in ultra low-k (ULK) dual damascene integration
2006
Valli Arunachalam
Gregory C. Smith
Sridhar Kailasam
Andreas Knorr
Kam Hettiaratchi
Robert T. Rozbicki
Klaus Pfeifer
Paul S. Ho
Jung Woo Pyun
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Effect of barrier process on electromigration reliability of Cu/porous low-k interconnects
2006
Journal of Applied Physics
Jung Woo Pyun
Won-Chong Baek
Jay Im
Paul S. Ho
Larry Smith
Kyle Neuman
Klaus Pfeifer
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Citations (11)
Electrical Properties of Organic and Silicon Carbide Etch Stop Layers in Copper/Porous MSQ Structures
2006
Gregory Smith
Richard McGowan
Sharath Hosali
Larry Smith
Klaus Pfeifer
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