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Won Kyoung Choi
Won Kyoung Choi
STATS ChipPAC Ltd
Materials science
Electronic engineering
Wafer-level packaging
Ball grid array
Wafer
3
Papers
17
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Ultra Fine Pitch RDL Development in Multi-layer eWLB (embedded Wafer Level BGA) Packages
2015
Won Kyoung Choi
Duk Ju Na
Kyaw Oo Aung
Andy Yong
Jae Sik Lee
Urmi Ray
Riko Radojcic
Bernard Adams
Seung Wook Yoon
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Citations (3)
Board level solder joint reliability modeling of Embedded Wafer Level BGA (eWLB) packages under temperature cycling test conditions
2011
EPTC | Electronics Packaging Technology Conference
Seng Guan Chow
Won Kyoung Choi
Roger Emigh
Eric Ouyang
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2.5D/3D TSV processes development and assembly/packaging technology
2011
EPTC | Electronics Packaging Technology Conference
Seung Wook Yoon
Duk Ju Na
Won Kyoung Choi
Keon Taek Kang
Chang Bum Yong
YoungChul Kim
Pandi C. Marimuthu
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Citations (5)
1