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Ultra Fine Pitch RDL Development in Multi-layer eWLB (embedded Wafer Level BGA) Packages
Ultra Fine Pitch RDL Development in Multi-layer eWLB (embedded Wafer Level BGA) Packages
2015
Won Kyoung Choi
Duk Ju Na
Kyaw Oo Aung
Andy Yong
Jae Sik Lee
Urmi Ray
Riko Radojcic
Bernard Adams
Seung Wook Yoon
Keywords:
Embedded Wafer Level Ball Grid Array
Wafer
multi layer
Optoelectronics
Ball grid array
ultra fine
Materials science
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