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J. Siegert
J. Siegert
ams AG
Analytical chemistry
Interposer
Silicon
Through-silicon via
Engineering
3
Papers
10
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0
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Etching Mechanisms of SiO₂ and SiNₓ:H Thin Films in HF/Ethanol Vapor Phase: Toward High Selectivity Batch Release Processes
2019
IEEE\/ASME Journal of Microelectromechanical Systems
S. Guillemin
P. Mumbauer
H. Radtke
M. Fimberger
S. Fink
J. Kraxner
A. Faes
J. Siegert
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Citations (2)
Advanced detection method for polymer residues on semiconductor substrates: 3D/TSV/interposer: Through silicon via and packaging
2016
ASMC | Advanced Semiconductor Manufacturing Conference
Helene Richter
Lothar Pfitzner
Markus Pfeffer
Anton J. Bauer
J. Siegert
T. Bodner
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ATHENIS_3D: Automotive tested high-voltage and embedded non-volatile integrated SoC platform with 3D technology
2016
DATE | Design, Automation, and Test in Europe
E. Wachmann
Sergio Saponara
Cristian Zambelli
Pierre Tisserand
J. Charbonnier
Tobias Erlbacher
S. Gruenler
C. Hartler
J. Siegert
Pierre Chassard
Dieu-My Ton
Lorenzo Ferrari
Luca Fanucci
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Citations (8)
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