Advanced detection method for polymer residues on semiconductor substrates: 3D/TSV/interposer: Through silicon via and packaging

A novel inspection technology for detection of thin polymer layers, deposited on structured silicon wafer surfaces, has been developed. The labeling of polymer residues with fluorophore combined with the subsequent examination under a fluorescence microscope enables a non-destructive detection of amorphous and semi-crystalline polymers and polymer residues on wafer substrates.