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W. B. Shieh

United Microelectronics Corporation

5

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3

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A simulation-based defect disposition flow for incoming mask quality assurance

2005
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The study of phase angle effects to wafer process window using 193-nm EAPSM in a 300-mm wafer manufacturing environment

2004
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Correlating reticle pinhole defects to wafer printability for the 90-nm node lithography using advanced RET

2004
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Automated Defect Severity Analysis for Binary and PSM Mask Defects

2002
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Impact and characterization of mask repair on wafer CD uniformity

2001
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