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Chin Chih Tseng
Chin Chih Tseng
DuPont
Lithography
Process window
Wafer
Resist
Engineering
2
Papers
3
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The study of phase angle effects to wafer process window using 193-nm EAPSM in a 300-mm wafer manufacturing environment
2004
William Chou
Shih-Ming Yen
J. K. Wu
W. B. Shieh
Mars Chuang
George Fan
Chin Chih Tseng
Gregory P. Hughes
Susan S. MacDonald
Carrie Holiday
Gong Chen
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Characterization of repairs to KrF 300mm wafer printability for 0.13μm design rule with attenuated phase-shifting mask
2002
William Chou
Tsung Chen
Will Tseng
Peter Huang
Chin Chih Tseng
Mars Chung
Dick Wang
Norman Huang
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Citations (3)
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