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Thomas Ponnuswamy
Thomas Ponnuswamy
Metallurgy
Copper
Materials science
Ruthenium
Electroplating
2
Papers
7
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Direct seed electroplating of copper on ruthenium liners
2011
IITC | International Interconnect Technology Conference
Rohan Akolkar
Tejaswi K. Indukuri
James S. Clarke
Thomas Ponnuswamy
Jonathan Reid
Andrew J. McKerrow
Sesha Varadarajan
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Citations (3)
Low resistance wiring and 2Xnm void free fill with CVD Ruthenium liner and DirectSeed TM copper
2010
IITC | International Interconnect Technology Conference
Jonathan Rullan
Tadahiro Ishizaka
Frank M. Cerio
Shigeru Mizuno
Yasushi Mizusawa
Thomas Ponnuswamy
Jon Reid
Andrew J. McKerrow
Chih-Chao Yang
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Citations (4)
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