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Jonathan Reid
Jonathan Reid
Metallurgy
Electroplating
Copper
Electrode
Copper interconnect
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3
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Direct seed electroplating of copper on ruthenium liners
2011
IITC | International Interconnect Technology Conference
Rohan Akolkar
Tejaswi K. Indukuri
James S. Clarke
Thomas Ponnuswamy
Jonathan Reid
Andrew J. McKerrow
Sesha Varadarajan
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Citations (3)
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