A Comparison of Metal Adhesion Layers for Au Films in Thermo-Plasmonic Applications

William M. Abbott,C. Murray,Sorcha Ni Lochlainn,Frank Bello,Chuan Zhong,Christopher M. Smith,Amanda K. Petford-Long,John F. Donegan,David McCloskey

A Comparison of Metal Adhesion Layers for Au Films in Thermo-Plasmonic Applications

2019

William M. Abbott
C. Murray
Sorcha Ni Lochlainn
Frank Bello
Chuan Zhong
Christopher M. Smith
Amanda K. Petford-Long
John F. Donegan
David McCloskey

The dewetting resistance of Au 50 nm films fabricated atop Ti/Ta/W/Cr/Al adhesion layers (0.5-5 nm) was investigated. Results show sub-nanometer Ta has superior stability under thermal stress, while W & Ti show best plasmonic response.

Keywords:

Optoelectronics
Plasmon
Adhesion
Physics
Metal
Thin film
Materials science
Stress (mechanics)
Dewetting
Surface plasmon polariton
Composite material
Transmission electron microscopy

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