Characterization of a next-generation step-and-scan system

Deep-ultaviolet (DUV) step-and-scan projection systems have been increasing in semiconductor manufacturing importance in recent years. IBM and other semiconductor manufacturers have made substantial use of 0.50 numerical aperture (NA) step-and- scan systems for production resolutions down to approximately 250 nm resolution. This paper describes the initial system characterization and product performance of a next generation, 0.60 NA scanner system in early semiconductor production.