Effective and combined stressors from multi-dimensional mission profiles for semiconductor reliability

Abstract As mission profiles start to become an essential part of reliability requirements and qualification in the automotive industry, processing multi-dimensional mission profiles with combined stressors requires special attention. We present a method to reduce mission profiles to effective and resulting acceleration factors as a means of dealing with mission profiles for reliability testing. This is elaborated on the first reported iterative step-stress TDDB failure measurement with coupled temperature and voltage stresses. Furthermore, the impact of interdependent stressors on reliability predictions, testing, and qualification is demonstrated with two-dimensional real-world mission profiles for OLED vehicle lighting and a temperature and relative humidity accelerated failure mechanism.