Simulation of plasma processes with two-dimensional program TITAN

As plasma processes play an increasing role in microengineering technology, the need for accurate simulators becomes mandatory. Simulation is usefull to test the validity of new ideas before realizing them practically, but can also help to a better understanding of physical phenomena and, finally, to optimize processes. This paper summarizes the state of the program TITAN in the field of plasma processes simulation, especially on PECVD, reactive ion etching and sputter etching. Accent is put on the geometrical effects.