High-heat stability amorphous film of copper-refractory metal and preparation method thereof
2010
The invention relates to a high-heat stability amorphous film of copper-refractory metal and a preparation method thereof, belonging to the metal interconnection film material for the electronic industry and the preparation technology. In the invention, one or more of copper and refractory metal such as Nb, W or Mo are prepared into composite a target material; the composite target material is taken as a sputtering source; the amorphous film of the copper-refractory metal is deposited by using a magnetic control sputtering method assistant by ion beams; and the atom percent of the refractory metal in the film is controlled to be 23.4-38.0%. The amorphous film prepared by the technology of the invention has high heat stability, strong electrical conductivity, large hardness, excellent comprehensive performance; and the technology is efficient and reliable, and can further widen the application range of the materials.
Keywords:
- Correction
- Source
- Cite
- Save
- Machine Reading By IdeaReader
0
References
0
Citations
NaN
KQI