Old Web
English
Sign In
Acemap
>
authorDetail
>
Co Van Veen
Co Van Veen
Wafer backgrinding
Wafer dicing
Through-silicon via
Wafer testing
Flip chip
1
Papers
3
Citations
0.00
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (1)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
A new wafer level chip size MCM-D technology for cellular applications
2001
Marc De Samber
Co Van Veen
Marc Van Delden
Robert Milsom
Nick Pulsford
Show All
Source
Cite
Save
Citations (3)
1