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Yannick Le Tiec
Yannick Le Tiec
Wafer bonding
Materials science
Composite material
Thermal
Solvent
2
Papers
6
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Direct Wafer Bonding Surface Conditioning
2011
Hubert Moriceau
Yannick Le Tiec
Frank Fournel
Ludovic Ecarnot
Sebastien Kerdiles
Daniel Delprat
Christophe Maleville
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Citations (4)
Drying Impact on Semiconductor Surfaces after Innovative Solvent Exposure
2009
Yannick Le Tiec
Frank Fournel
N. Rochat
Jean-Paul Barnes
M. Veillerot
Christophe Morales
Hubert Moriceau
Laurent Clavelier
F. Rieutord
Carlos Morote
Martin Vandenbossche
Jeff Butterbaugh
Ionut Radu
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Citations (2)
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