Old Web
English
Sign In
Acemap
>
Paper
>
Direct Wafer Bonding Surface Conditioning
Direct Wafer Bonding Surface Conditioning
2011
Hubert Moriceau
Yannick Le Tiec
Frank Fournel
Ludovic Ecarnot
Sebastien Kerdiles
Daniel Delprat
Christophe Maleville
Keywords:
Anodic bonding
Thermocompression bonding
Hydrophobic surfaces
Wafer bonding
Composite material
Wet cleaning
Materials science
Correction
Source
Cite
Save
Machine Reading By IdeaReader
93
References
4
Citations
NaN
KQI
[]