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H. Luesebrink
H. Luesebrink
Materials science
Chip
Electronic engineering
Flip chip
Wafer dicing
5
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17
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Yield and reliability in flip chip underfill for optical modules
2014
IMPACT | International Microsystems, Packaging, Assembly and Circuits Technology Conference
Shuki Benjamin
A. Maman
U. Decker
W. Pleyer
H. Luesebrink
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Full integration of a 3D demonstrator with TSV first interposer, ultra thin die stacking and wafer level packaging
2013
ECTC | Electronic Components and Technology Conference
G. Pares
C. Karoui
A. Zaid
Franck Dosseul
M. Feron
A. Attard
G. Klug
H. Luesebrink
K. Martinschitz
N. Launay
S. Belhenini
G. Simon
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Citations (12)
Yield and reliability in 3D interconnect and WLP — Ultra thin chip stacking
2013
ECTC | Electronic Components and Technology Conference
H. Luesebrink
G. Pares
A. Attard
F. Schnegg
G. Klug
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Citations (1)
ULTRA THIN CHIPS STACKING ON TSV SILICON INTERPOSER USING BACK-TO-FACE TECHNOLOGY
2012
G. Parès
F. Schnegg
A. Attard
D. Cruau
F. De Crecy
A. N'hari
R. Anciant
G. Klug
H. Luesebrink
K. Martinschitz
C. Karoui
G. Simon
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Citations (4)
NILCom ® - Commercialization of Nanoimprint Lithography
2005
H. Luesebrink
Thomas Glinsner
Ch. Moormann
M. Bender
A. Fuchs
Erich Thallner Strasse
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