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Hideki Tokuyama
Hideki Tokuyama
Electronic component
Printed circuit board
Composite material
Materials science
Mold
2
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2024
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A method of sealing with resin, and the resin material for the process
2003
Hiroshi Uragami
Osamu Nakagawa
Kinya Fujino
Shinji Takase
Hideki Tokuyama
Koichi Meguro
Toru Nishino
Noboru Hayasaka
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樹脂封止方法、半導体装置の製造方法、及び樹脂材料
2002
Kinya Fujino
Noboru Hayasaka
Koichi Meguro
Takeru Nakagawa
Toru Nishino
Shinji Takase
Hideki Tokuyama
Hiroshi Uragami
zhangzhongchuan
hideki tokuyama
noboru hayasaka
hirosi uragami
kouiti meguro
kinya fuzino
tooru nisino
sinzi takase
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