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Ph. Lyan
Ph. Lyan
Materials science
Analytical chemistry
Air gap (plumbing)
Copper interconnect
Electronic engineering
3
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44
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Multi-Level Cu Interconnects Integration and Characterization with Air Gap as Ultra-Low K Material Formed using a Hybrid Sacrificial Oxide / Polymer Stack
2007
IITC | International Interconnect Technology Conference
L.G. Gosset
Frederic Gaillard
D. Bouchu
R. Gras
J. de Pontcharra
S. Orain
O. Cueto
Ph. Lyan
O. Louveau
G. Passemard
J. Torres
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Citations (7)
Chemical etching solutions for air gap formation using a sacrificial oxide/polymer approach
2006
Microelectronic Engineering
Frederic Gaillard
J. de Pontcharra
L.G. Gosset
Ph. Lyan
D. Bouchu
Roel Daamen
O. Louveau
P. Besson
G. Passemard
J. Torres
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Citations (14)
Advanced Cu interconnects using air gaps
2005
Microelectronic Engineering
L.G. Gosset
A. Farcy
J. de Pontcharra
Ph. Lyan
Roel Daamen
Greja Johanna Adriana Maria Verheijden
V. Arnal
Frederic Gaillard
D. Bouchu
Pascal Bancken
T. Vandeweyer
J. Michelon
V. Nguyen Hoang
R.J.O.M. Hoofman
J. Torres
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Citations (23)
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