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Greja Johanna Adriana Maria Verheijden

Philips

7

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138

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Challenges in the implementation of low-k dielectrics in the back-end of line

2005 Microelectronic Engineering
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Advanced Cu interconnects using air gaps

2005 Microelectronic Engineering
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Reliability challenges accompanied with interconnect downscaling and ultra low-k dielectrics

2005 IITC | International Interconnect Technology Conference
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Air gap integration for the 45nm node and beyond

2005 IITC | International Interconnect Technology Conference
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General review of issues and perspectives for advanced copper interconnections using air gap as ultra-low K material

2003 IITC | International Interconnect Technology Conference
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