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Yasuyuki Yanase
Yasuyuki Yanase
Sanyo
Materials science
Wafer-level packaging
Wafer dicing
Composite material
Etching (microfabrication)
4
Papers
6
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0
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Dispositif d'assemblage de métaux
2012
Takashi Suzuki
takayuki suzuki
Kouichi Saitou
saitou kouiti
Yasuyuki Yanase
yasuyuki yanase
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Fine pitch connection and thermal stress analysis of a novel Wafer Level Packaging technology using laminating process
2010
ECTC | Electronic Components and Technology Conference
Yoshio Okayama
Mayumi Nakasato
Kouichi Saitou
Yasuyuki Yanase
Hajime Kobayashi
Tetsuya Yamamoto
Ryosuke Usui
Yasunori Inoue
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半導体素子、半導体モジュール、半導体モジュールの製造方法および携帯機器
2009
Takahiro Fujii
Yoshihisa Okayama
Koichi Saito
Yasuyuki Yanase
hou ou okayama
yasuyuki yanase
takahiro fuzii
kouiti saitou
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Development of a novel Wafer-Level-Packaging technology using laminating process
2009
ECTC | Electronic Components and Technology Conference
Yoshio Okayama
Yasuyuki Yanase
Kouichi Saitou
Hajime Kobayashi
Mayumi Nakasato
Tetsuya Yamamoto
Ryosuke Usui
Yasunori Inoue
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Citations (3)
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