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Hajime Kobayashi
Hajime Kobayashi
Sanyo
Materials science
Wafer-level packaging
Wafer dicing
Composite material
Etching (microfabrication)
3
Papers
6
Citations
0
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2024
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Fine pitch connection and thermal stress analysis of a novel Wafer Level Packaging technology using laminating process
2010
ECTC | Electronic Components and Technology Conference
Yoshio Okayama
Mayumi Nakasato
Kouichi Saitou
Yasuyuki Yanase
Hajime Kobayashi
Tetsuya Yamamoto
Ryosuke Usui
Yasunori Inoue
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Citations (3)
Development of a novel Wafer-Level-Packaging technology using laminating process
2009
ECTC | Electronic Components and Technology Conference
Yoshio Okayama
Yasuyuki Yanase
Kouichi Saitou
Hajime Kobayashi
Mayumi Nakasato
Tetsuya Yamamoto
Ryosuke Usui
Yasunori Inoue
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素子搭載用基板およびその製造方法、半導体モジュールおよびその製造方法、ならびに携帯機器
2007
Yasunori Inoue
Hajime Kobayashi
Yoshihisa Okayama
Yasuyuki Yanase
yasunori inoue
hatu kobayasi
hou ou okayama
yasuyuki yanase
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