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W. H. Teh
W. H. Teh
Singapore Science Park
Anodic bonding
Wafer bonding
Analytical chemistry
Wafer
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3
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Adhesion Studies of Ta ∕ Low-k (Black Diamond) Interface using Thermocompressive Wafer Bonding and Four-Point Bend
2006
Journal of The Electrochemical Society
W. H. Teh
C.-F. Tsang
Alastair David Trigg
K. W. Teoh
R. Kumar
N Balasubramanian
Dim-Lee Kwong
S. E. Ong
Farah Malik
Chee Lip Gan
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Citations (7)
200 mm wafer-scale epitaxial transfer of single crystal Si on glass by anodic bonding of silicon-on-insulator wafers
2005
Applied Physics Letters
W. H. Teh
Alastair Trigg
C.H. Tung
Rakesh Kumar
N Balasubramanian
Dim-Lee Kwong
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Citations (14)
200 mm wafer-scale substrate transfer of 0.13μmCu∕low-k (Black Diamond™) dual-damascene interconnection to glass substrates
2005
Applied Physics Letters
W. H. Teh
Rakesh Kumar
Dim-Lee Kwong
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Citations (4)
1