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Chin-Tang Hsieh
Chin-Tang Hsieh
Flip chip
Adhesion
Temperature cycling
Materials science
Business
6
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9
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Three dimensional interconnect using Au and pillar bumps
2013
ECTC | Electronic Components and Technology Conference
Fei-Jain Wu
Lung-Hua Ho
Chih-Ming Kuo
Chia-Jung Tu
Chin-Tang Hsieh
Chih-Hsien Ni
Shih-chieh Chang
Chuan-Yu Wu
Hui-yu Huang
Kung-An Lin
You-Ming Hsu
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Citations (2)
Effect of growth conditions on the structure and properties of tungsten films prepared using a thermal evaporation process
2007
Journal of Vacuum Science and Technology
Chin-Tang Hsieh
Jyh-Ming Ting
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Citations (6)
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