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Chih-Ming Kuo
Chih-Ming Kuo
Composite material
Materials science
Electronic engineering
Thermal copper pillar bump
Flip chip
2
Papers
4
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Six-die stacking: Three-dimensional interconnects using Au and pillar bumps
2014
ECTC | Electronic Components and Technology Conference
Fei-Jain Wu
Lung-Hua Ho
Chih-Ming Kuo
Chia-Jung Tu
Chih-Hsien Ni
Shih-chieh Chang
Chuan-Yu Wu
Kung-An Lin
Wei-Hsin Wu
Yung Shen Wu
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Three dimensional interconnect using Au and pillar bumps
2013
ECTC | Electronic Components and Technology Conference
Fei-Jain Wu
Lung-Hua Ho
Chih-Ming Kuo
Chia-Jung Tu
Chin-Tang Hsieh
Chih-Hsien Ni
Shih-chieh Chang
Chuan-Yu Wu
Hui-yu Huang
Kung-An Lin
You-Ming Hsu
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Citations (2)
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