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Patrick Peray
Patrick Peray
Materials science
Electronic engineering
Image sensor
Light-emitting diode
Wafer-level packaging
5
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6
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Curved OLED microdisplays
2019
Journal of The Society for Information Display
Tony Maindron
Bertrand Chambion
Marion Provost
Aurélie Vandeneynde
Patrick Peray
Marc Zussy
Jérôme Dechamp
Cyrille Rossat
Stéphanie Gonnin
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Citations (5)
Development of a wafer level packaging technology for high voltage applications
2018
Electronics System-integration Technology Conference
Marion Volpert
Abdenacer Ait Mani
A. Gasse
Brigitte Soulier
Patrick Peray
A. Vandeneynde
Bertrand Chambion
David Henry Francois Levy
Frédéric Mercier
Pamela Rueda
Vincent Beix
Thomas Lacave
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New Wafer Level Packaging Concept for Power LEDS
2017
Marion Volpert
Brigitte Soulier
Patrick Peray
N. Ait-Mani
A. Gasse
D. Henry
C. Tallet
Vincent Beix
A. Aboulaich
C. Zheng-Sung
J.-L. Diot
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