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Patrick Peray
Patrick Peray
Materials science
Electronic engineering
Image sensor
Light-emitting diode
Wafer-level packaging
5
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6
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Curved OLED microdisplays
2019
Journal of The Society for Information Display
Tony Maindron
Bertrand Chambion
Marion Provost
Aurélie Vandeneynde
Patrick Peray
Marc Zussy
Jérôme Dechamp
Cyrille Rossat
Stéphanie Gonnin
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Citations (5)
Collective Curved CMOS Sensor Process: Application for High-Resolution Optical Design and Assembly Challenges
2019
ECTC | Electronic Components and Technology Conference
Bertrand Chambion
Christophe Gaschet
Marc Lombard
Mailys Fernandez
Pierre Joly
Stéphane Caplet
Fabien Zuber
Aurélie Vandeneynde
Patrick Peray
Gilles Lasfargues
Marc Zussy
Jérôme Deschamps
Alexis Bedoin
David Henry
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Citations (1)
Development of a wafer level packaging technology for high voltage applications
2018
Electronics System-integration Technology Conference
Marion Volpert
Abdenacer Ait Mani
A. Gasse
Brigitte Soulier
Patrick Peray
A. Vandeneynde
Bertrand Chambion
David Henry Francois Levy
Frédéric Mercier
Pamela Rueda
Vincent Beix
Thomas Lacave
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Curved Full-Frame CMOS Sensor: Impact on Electro-Optical Performances
2018
Electronics System-integration Technology Conference
Bertrand Chambion
Stéphane Caplet
Jan Martin Kopfer
A. Vandeneynde
Wim Diels
Alexandre de Kerckhove
Patrick Peray
David Henry
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New Wafer Level Packaging Concept for Power LEDS
2017
Marion Volpert
Brigitte Soulier
Patrick Peray
N. Ait-Mani
A. Gasse
D. Henry
C. Tallet
Vincent Beix
A. Aboulaich
C. Zheng-Sung
J.-L. Diot
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