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J.-L. Diot
J.-L. Diot
Dip soldering
Soldering
Engineering
Power electronic substrate
Electronic engineering
2
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New Wafer Level Packaging Concept for Power LEDS
2017
Marion Volpert
Brigitte Soulier
Patrick Peray
N. Ait-Mani
A. Gasse
D. Henry
C. Tallet
Vincent Beix
A. Aboulaich
C. Zheng-Sung
J.-L. Diot
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A new surface mount power package
1993
APEC | Applied Power Electronics Conference
A. Ehnert
V. Sukumar
J.-L. Diot
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