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Hiroki Myodo
Hiroki Myodo
Composite material
Thermocompression bonding
Flip chip
Materials science
Scanning electron microscope
5
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2
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0
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Development of High Thermally Conductive Die Attach for TIM Applications
2019
Maciej Patelka
Sho Ikeda
Koji Sasaki
Hiroki Myodo
Nortisuka Mizumura
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Study of high UPH TCB process with slow cure NCP
2017
ICEP | International Conference on Electronics Packaging
Hiroki Myodo
Yusuke Kamata
Yukihiro Ikeda
Masaaki Hoshiyama
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Improvement of connectivity in Cu/OSP flip chip package using slow cure NCP
2015
EMPC | European Microelectronics and Packaging Conference
Masaaki Hoshiyama
Yuusuke Kamata
Makoto Kobayashi
Hiromi Sone
Hiroki Myodo
Toshikazu Hocchi
Hirotatsu Ikarashi
Shinichi Munemura
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Improvement of connectivity in Cu/OSP flip chip package using NCP
2013
EMPC | European Microelectronics and Packaging Conference
Masaaki Hoshiyama
Toyokazu Hocchi
Hirotatsu Ikarashi
Yosuke Sakai
Hiroki Myodo
Takuya Hoshino
Shinichi Munemura
Kiyoshi Kotaka
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Improvement of connectivity in Cu/OSP flip chip package using NCP
2013
EMPC | European Microelectronics and Packaging Conference
Masaaki Hoshiyama
Toyokazu Hocchi
Hirotatsu Ikarashi
Yosuke Sakai
Hiroki Myodo
Takuya Hoshino
Shinichi Munemura
Kiyoshi Kotaka
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