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Toshikazu Hocchi
Toshikazu Hocchi
Chip
Flip chip
Composite material
Materials science
Void (astronomy)
2
Papers
1
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0
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The advantage of Slow Cure NCP in filp chip package
2016
ICEP | International Conference on Electronics Packaging
Yoshihide Fukuhara
Masaaki Hoshiyama
Toshikazu Hocchi
Yuusuke Kamata
Hirotatsu Ikarashi
Ruka Iwaya
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Improvement of connectivity in Cu/OSP flip chip package using slow cure NCP
2015
EMPC | European Microelectronics and Packaging Conference
Masaaki Hoshiyama
Yuusuke Kamata
Makoto Kobayashi
Hiromi Sone
Hiroki Myodo
Toshikazu Hocchi
Hirotatsu Ikarashi
Shinichi Munemura
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