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Peggy John
Peggy John
Fraunhofer Society
Materials science
Electronic engineering
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5
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42
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Development of process and design criteria for stress management in through silicon vias
2014
ECTC | Electronic Components and Technology Conference
O. Hölck
M. Nuss
Arian Grams
Tobias Prewitz
Peggy John
Conny Fiedler
Mathias Bottcher
H. Walter
M. J. Wolf
Olaf Wittler
K.-D. Lang
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Citations (10)
3D integration of standard integrated circuits
2013
DIC | IEEE International D Systems Integration Conference
Rene Puschmann
Mathias Bottcher
Irene Bartusseck
Frank Windrich
Conny Fiedler
Peggy John
Charles Alix Manier
Kai Zoschke
Jurgen Grafe
Hermann Oppermann
Jürgen Wolf
K. Dieter Lang
Michael Ziesmann
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Investigation of different methods for isolation in through silicon via for 3D integration
2013
Microelectronic Engineering
Stephane Sage
Peggy John
Stephan Dobritz
Jochen Börnge
J. Vitiello
Matthias Böttcher
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Citations (13)
Via last technology for direct stacking of processor and flash
2012
ECTC | Electronic Components and Technology Conference
Rene Puschmann
Mathias Bottcher
Michael Ziesmann
Irene Bartusseck
Frank Windrich
Conny Fiedler
Peggy John
Charles Alix Manier
Kai Zoschke
Jurgen Grafe
Hermann Oppermann
M. Jürgen Wolf
K. Dieter Lang
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Citations (14)
Strukturmodifizierung von TiN Hartstoffschichten durch zeitliche variation der Abscheideparameter
1997
Karen Pantleon
Peggy John
Hagen Sahm
Heinrich Oettel
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