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Uday Mahajan
Uday Mahajan
Applied Materials
Electronic engineering
Materials science
Wafer-level packaging
Monolayer
Wafer
3
Papers
2
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0
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Nanoparticule à base de boues d'oxyde de cérium
2015
Ranga Rao Arnepalli
Robert Jan Visser
Rajeev Bajaj
Darshan Thakare
Prerna Goradia
Uday Mahajan
Abdul Wahab Mohammed
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Electrical parametric and reliability of 5×50um TSVs for 3D IC
2014
IITC | International Interconnect Technology Conference
Bharat Bhushan
Chin Hock Toh
Anthony Chan
Isaac Ow
Loke Yuen Wong
Arkajit Roy Barman
Shalina Sudheeran
Chandra Rao
Wahab Mohammed Abdul
Jason Chew
Jay Vijayen
Uday Mahajan
David Ericson
Niranjan Kumar
Sesh Ramaswami
Arvind Sundarrajan
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Characterization and optimization of a TSV CMP reveal process using a novel wafer inspection technique for detecting sub-monolayer surface contamination
2013
DIC | IEEE International D Systems Integration Conference
Jason Chew
Uday Mahajan
Rajeev Bajaj
Iad Mirshad
Robert Newcomb
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