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Tackeun Oh
Tackeun Oh
SK Hynix
Materials science
Electronic engineering
Intermetallic
Composite material
Electromigration
2
Papers
6
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Mechanical and Thermal Characterization of TSV Multi-chip Stacked Packages for Reliable 3D IC Applications
2016
ECTC | Electronic Components and Technology Conference
Ho-Young Son
Tackeun Oh
Joo Wan Hong
Byeong Do Lee
Ji-Hyuk Shin
Sung Ho Kim
Nam-Seog Kim
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Citations (5)
Structure effects on the electrical reliability of fine-pitch Cu micro-bumps for 3D integration
2014
ECTC | Electronic Components and Technology Conference
Byeong-Rok Lee
June-Bum Kim
Seunghyun Kim
Byeong-Hyun Bae
Ho-Young Son
Tackeun Oh
Min Suk Suh
Nam-Seog Kim
Young-Bae Park
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Citations (1)
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