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June-Bum Kim
June-Bum Kim
Andong National University
Composite material
Materials science
Electronic engineering
Electromigration
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3
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7
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Structure effects on the electrical reliability of fine-pitch Cu micro-bumps for 3D integration
2014
ECTC | Electronic Components and Technology Conference
Byeong-Rok Lee
June-Bum Kim
Seunghyun Kim
Byeong-Hyun Bae
Ho-Young Son
Tackeun Oh
Min Suk Suh
Nam-Seog Kim
Young-Bae Park
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Current density effects on the electrical reliability of ultra fine-pitch micro-bump for TSV integration
2013
ECTC | Electronic Components and Technology Conference
Young-Bae Park
Seunghyun Kim
Jong-Jin Park
June-Bum Kim
Ho-Young Son
Kwon-Whan Han
Jae Sung Oh
Nam-Seog Kim
Sehoon Yoo
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Citations (5)
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