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Harufusa Kondoh
Harufusa Kondoh
Electronic engineering
XENPAK
10 Gigabit Ethernet
Ethernet
Physical layer
2
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2
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0
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ENHANCED NETWORK SIGNALING FOR 10 GIGABIT ETHERNET TO ACHIEVE A LAN-WAN SEAMLESS INTERFACE AND ITS IMPLEMENTATION IN THE PHY-LSI/TRANSCEIVER MODULE
2005
International Journal of High Speed Electronics and Systems
Haruhiko Ichino
Kazuhiko Terada
Kenji Kawai
Osamu Ishida
Keishi Kishine
Noboru Iwasaki
Tetsuhiro Fukao
Shinji Shibao
Kazuo Kubo
Harufusa Kondoh
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Citations (2)
A 622Mbps 8??8 ATM Switch Chip Set with Shared Multi-Buffer Architecture
1992
Colloids and Surfaces B: Biointerfaces
Harufusa Kondoh
Hiromi Notani
Hidetoshi Yamanaka
Koyo Higashitani
Hideo Saito
Isao Hayashi
Steven G. Kohama
Yoichi Matsuda
Kevin H. Oshima
Makoto Nakaya
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