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J. Puigcorbé
J. Puigcorbé
Electronic engineering
Creep
Finite element method
Engineering
Stress (mechanics)
4
Papers
5
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Zaguán de cortén.Plaza cubierta y pasarela en Ripoll, Gerona.
2011
J. Puigcorbé
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Finite Element Modelling of Flip Chip Gold-Gold Thermocompression Bonding
2003
Journal of Electronic Packaging
J. Puigcorbé
S. Marco
S. Leseduarte
Manuel Carmona
O. Vendier
C. Devron
Sylvain Delage
D. Floriot
H. Blanck
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Citations (3)
Residual thermomechanical stresses in ultrathin chip stack technology
2000
DTIP | Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
J. Puigcorbé
S. Leseduarte
S. Marco
Eric Beyne
Rita Van Hoof
Antoine Marty
S. Pinel
O. Vendier
Augustin Coello-Vera
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Citations (1)
Residual Thermo-mechanical stresses in ultra thin chip stack technology
2000
J. Puigcorbé
S. Leseduarte
S. Marco
Eric Beyne
R. van Hoof
Antoine Marty
S. Pinel
O. Vendier
Augustin Coello-Vera
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