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Rita Van Hoof
Rita Van Hoof
IMEC
Electronic engineering
Materials science
Interconnection
Thin film
Substrate (chemistry)
5
Papers
28
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High density interconnect substrates using multilayer thin film technology on laminate substrates (MCM-SL/D)
2001
Microelectronics International
Eric Beyne
Rita Van Hoof
Tomas Webers
S. Brebels
Stephanie Rossi
Francois Lechleiter
Marianna Di Ianni
Andreas Ostmann
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Citations (6)
High density interconnect substrates using multilayer thin film technology on laminate substrates (MCM-SL/D)
2000
Eric Beyne
Rita Van Hoof
Tomas Webers
Francois Lechleiter
Stephanie Rossi
Marianni Di Ianni
Andreas Ostmann
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Citations (2)
Residual thermomechanical stresses in ultrathin chip stack technology
2000
DTIP | Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
J. Puigcorbé
S. Leseduarte
S. Marco
Eric Beyne
Rita Van Hoof
Antoine Marty
S. Pinel
O. Vendier
Augustin Coello-Vera
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Citations (1)
New ultrathin 3D integration technique: technological and thermal investigations
2000
DTIP | Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
S. Pinel
Josiane Tasselli
Antoine Marty
Jean-Pierre Bailbe
Eric Beyne
Rita Van Hoof
S. Marco
S. Leseduarte
O. Vendier
Augustin Coello-Vera
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Citations (3)
The Use of BCB and Photo-BCB Dielectric in MCM-D for High Speed Digital and Microwave Applications
1995
Eric Beyne
Rita Van Hoof
A. Achem
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Citations (16)
1