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Strogies
Strogies
Electron backscatter diffraction
Copper
Composite material
Soldering
Materials science
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Effects of additional Co atoms on microstructural evolution in Sn-Ag-Bi-In solder under current stressing
2011
EMPC | European Microelectronics and Packaging Conference
Lee
Suganuma
Kim
Ueshima
Albrecht
Wilke
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