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Effects of additional Co atoms on microstructural evolution in Sn-Ag-Bi-In solder under current stressing
Effects of additional Co atoms on microstructural evolution in Sn-Ag-Bi-In solder under current stressing
2011
Lee
Suganuma
Kim
Ueshima
Albrecht
Wilke
Strogies
Keywords:
Electron backscatter diffraction
Copper
Composite material
Soldering
Materials science
Current (fluid)
microstructural evolution
Electromigration
Correction
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