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Jay Senkevich

Chonbuk National University

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Pore Sealing for Low-k Delectric Integration into Integrated Circuits

2006
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Substrate-dependent Copper Electroless Deposition

2006
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Erratum: Direct Copper Electroless Deposition on a Tungsten Barrier Layer for Ultralarge Scale Integration [ J. Electrochem. Soc. , 152 , C89 (2005) ]

2005 Journal of The Electrochemical Society
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A Pore Sealing CVD Polymer for Ultralow k Dielectrics

2004
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Effective pore sealing of ultralow-k dielectrics

2004
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