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Min Chi Liu
Min Chi Liu
Pillar
Organic solderability preservative
Electromigration
Microstructure
Intermetallic
2
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從《血色蝙蝠降臨的城市》談宋澤萊的佛教觀
2016
liuminqi
jiangshuzhen
Min Chi Liu
Shu-chen Chiang
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The physics of Cu pillar bump interconnect under electromigration stress testing
2014
ESTC | Electronics System-integration Technology Conference
Yu-Hsiang Hsiao
Chien-Fan Chen
Ping-Feng Yang
Chang Chi Lee
Min Chi Liu
Kwang-Lung Lin
Chiao Wen Chen
Bradford J. Factor
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