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Bradford J. Factor
Bradford J. Factor
Materials science
Pillar
Organic solderability preservative
Electromigration
Microstructure
3
Papers
4
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0
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Reliability investigations of large die wafer level package (part II): Impact of solder ball composition, die thickness, and polymer passivition on board level reliability
2016
Electronics System-integration Technology Conference
Chien-An Hsieh
Markus Järn
Yu-Chi Pai
Yi-Liang Chen
Bradford J. Factor
Tsaiying Wang
John Hunt
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The physics of Cu pillar bump interconnect under electromigration stress testing
2014
ESTC | Electronics System-integration Technology Conference
Yu-Hsiang Hsiao
Chien-Fan Chen
Ping-Feng Yang
Chang Chi Lee
Min Chi Liu
Kwang-Lung Lin
Chiao Wen Chen
Bradford J. Factor
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A simple, inexpensive flow indicator for cooling water
1975
Journal of Chemical Education
Arnold Factor
Bradford J. Factor
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