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Chang-Hyun Lim
Chang-Hyun Lim
Samsung
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Through-silicon via
Wafer-level packaging
Electronic engineering
Image sensor
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A low-cost through via interconnection for ISM WLP
2008
DTIP | Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
Jingli Yuan
Won-Kyu Jeung
Chang-Hyun Lim
Seung-Wook Park
Young Do Kweon
Sung Yi
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