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Contact pad
Contact pads or bond pads are designated surface areas of a printed circuit board or die of an integrated circuit. Possibilities to contact to pads include soldering, wirebonding, flip chip mounting, or probe needles. Contact pads or bond pads are designated surface areas of a printed circuit board or die of an integrated circuit. Possibilities to contact to pads include soldering, wirebonding, flip chip mounting, or probe needles.
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