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Hideto Yonekura
Hideto Yonekura
Kyocera
Materials science
Ceramic
Composite material
Ball grid array
Soldering
4
Papers
32
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New CBGA package with improved 2/sup nd/ level reliability
2000
ECTC | Electronic Components and Technology Conference
R. Pendse
B. Afshari
N. Butel
J. Leibovitz
Yoshihiro Hosoi
M. Shimada
K. Maeda
M. Maeda
Hideto Yonekura
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Improvement of Solder Joint Reliability between Multilayer Ceramic Package and Printed Wiring Board
1999
Journal of Japan Institute of Electronics Packaging
Masahiko Higashi
Noriaki Hamada
Hideto Yonekura
Kouichi Yamaguchi
Satoshi. Oike
Yasuyoshi Kunimatsu
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Evaluation of solder joint reliability between PWB and CSP by using high TCE ceramic material
1998
ECTC | Electronic Components and Technology Conference
Hideto Yonekura
Masahiko Higashi
N. Hmada
Kouichi Yamaguchi
M. Kokubu
M. Ikemizu
J. Nakano
T. Yokoi
H. Funakura
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Citations (5)
Improvement of solder joint reliability between multilayer ceramic package and printed wiring board by new ceramic material
1997
ECTC | Electronic Components and Technology Conference
Kouichi Yamaguchi
Masahiko Higashi
Hideto Yonekura
Noriaki Hamada
Yasuyoshi Kunimatsu
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Citations (7)
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