Old Web
English
Sign In
Acemap
>
authorDetail
>
J. Nakano
J. Nakano
Kyocera
Materials science
Electronic engineering
Chip-scale package
Ceramic
Composite material
2
Papers
10
Citations
0.00
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (2)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
Evaluation of solder joint reliability between PWB and CSP by using high TCE ceramic material
1998
ECTC | Electronic Components and Technology Conference
Hideto Yonekura
Masahiko Higashi
N. Hmada
Kouichi Yamaguchi
M. Kokubu
M. Ikemizu
J. Nakano
T. Yokoi
H. Funakura
Show All
Source
Cite
Save
Citations (5)
CSP solder ball reliability
1997
IEMT | International Electronics Manufacturing Technology Symposium
M. Ikemizu
Y. Fukuzawa
J. Nakano
T. Yokoi
K. Miyajima
H. Funakura
Eiichi Hosomi
Show All
Source
Cite
Save
Citations (5)
1