Old Web
English
Sign In
Acemap
>
authorDetail
>
Stian Martinsen
Stian Martinsen
Materials science
Composite material
Residual stress
Wafer
Silicon
4
Papers
38
Citations
0.00
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (4)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
CMOS-Integrated Si/SiGe Quantum-Well Infrared Microbolometer Focal Plane Arrays Manufactured With Very Large-Scale Heterogeneous 3-D Integration
2015
IEEE Journal of Selected Topics in Quantum Electronics
Fredrik Forsberg
Adriana Lapadatu
Gjermund Kittilsland
Stian Martinsen
Niclas Roxhed
Andreas Fischer
Göran Stemme
Björn Samel
Per Ericsson
Nils Hoivik
Thor Bakke
Martin Bring
Terje Kvisteroy
Audun Ror
Frank Niklaus
Show All
Source
Cite
Save
Citations (27)
Residual Stress in Silicon Caused by Cu-Sn Wafer-Level Packaging
2013
Maaike M. Visser Taklo
A.S. Vardøy
I. De Wolf
V. Simons
H.J. van de Wiel
A. van der Waal
Adriana Lapadatu
Stian Martinsen
B. Wunderle
Show All
Source
Cite
Save
Citations (4)
Void formation and bond strength investigated for wafer-level Cu-Sn solid-liquid interdiffusion (SLID) bonding
2013
Journal of microelectronics and electronic packaging
Astrid-Sofie B. Vardøy
H. J. van de Wiel
Stian Martinsen
Greg R. Hayes
Hartmut R Fischer
Knut E. Aasmundtveit
Adriana Lapadatu
Maaike M. Visser Taklo
Show All
Source
Cite
Save
Citations (1)
Systematic characterization of key parameters of hermetic wafer-level Cu-Sn SLID bonding
2013
EMPC | European Microelectronics and Packaging Conference
H.J. van de Wiel
Astrid-Sofie B. Vardøy
G. Hayes
M.H.M. Kouters
A. van der Waal
M. Erinc
Adriana Lapadatu
Stian Martinsen
Maaike M. Visser Taklo
H. R. Fischer
Show All
Source
Cite
Save
Citations (6)
1