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A.S. Vardøy
A.S. Vardøy
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Wafer-level packaging
Stress (mechanics)
Bolometer
Integrated circuit
Residual stress
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Residual Stress in Silicon Caused by Cu-Sn Wafer-Level Packaging
2013
Maaike M. Visser Taklo
A.S. Vardøy
I. De Wolf
V. Simons
H.J. van de Wiel
A. van der Waal
Adriana Lapadatu
Stian Martinsen
B. Wunderle
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Citations (4)
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